| Sr. Director, Networking Hardware Product Management | 2 Locations |
| Principal Engineer | 4 Locations |
| EDA Tools Software Engineer | US, Oregon, Hillsboro |
| Design Automation Engineer | US, Oregon, Hillsboro |
| Government Contracts Specialist | Japan, Tokyo |
| Senior Formal Verification Engineer – AI SoC Development | 4 Locations |
| Manufacturing Operators | Malaysia, Kulim |
| Sr. Substrates Development and Ramp Engineer | Taiwan, Taipei |
| ICE Graduate Talent | 2 Locations |
| Module Equipment Technician (Contract) | Malaysia, Penang |
| Wet Etch Cleans Technical Manager | US, Oregon, Hillsboro |
| Mixed Signal Logic Design Engineer | Malaysia, Penang |
| Module Engineer | Malaysia, Penang |
| Principal Engineer, Hybrid Bonding Module | US, Oregon, Hillsboro |
| IA Core Post Silicon Validation Engineer | US, Texas, Austin |
| Director, SoC Design Engineering | 3 Locations |
| Module Development Engineer - RF Test | US, Arizona, Phoenix |
| CPU HVM Functional-Test Verification Engineer | Malaysia, Penang |
| CPU Design Verification Engineer | Malaysia, Penang |
| APTM NPI Integration | US, New Mexico, Albuquerque |
| SAP MM/PP Business Systems Analyst | 4 Locations |
| CPU DFT Manager | India, Bangalore |
| Module Equipment Technician (Contract) | 2 Locations |
| Director, Silicon Design Engineering | 3 Locations |
| Equipment Development Engineer | Japan, Tokyo |
| Process Integration Development Engineer | US, Oregon, Hillsboro |
| Principal Engineer - Standard Cell Design | 5 Locations |
| Senior Program Managers | Japan, Tokyo |
| Senior Design Verification Engineer | US, California, Santa Clara |
| Director of Data Governance and Operations | 3 Locations |
| Contract Logistics Commodity Manager | Malaysia, Penang |
| Semiconductor Manufacturing Engineer (Segment Lead) (Contract) | Malaysia, Kulim |
| Director - Intel Foundry Pre-Silicon Design Quality and Reliability | 2 Locations |
| CPU Circuit Design Lead | India, Bangalore |
| CPU Verification Engineer | US, Texas, Austin |
| Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer | US, Arizona, Phoenix |
| Industrial Security Representative 1 | US, Oregon, Hillsboro |
| CUF TD Module Engineer | Malaysia, Kulim |
| Staff Semiconductor Device Modeling Engineer | 2 Locations |
| Senior Director , Data and Intelligence | India, Bangalore |
| Substrate Supplier Enablement Engineer | South Korea, Seoul |
| Quality Engineering Manager-Assembly Packaging Testing Manufacturing | 3 Locations |
| Senior Laser Designer | US, California, Santa Clara |
| Senior Laser and SOA Designer | US, California, Santa Clara |
| Spice Modeling Engineer | India, Bangalore |
| Platform Power Thermal Performance Engineer | PRC, Shanghai |
| Cloud and AI System Engineer | PRC, Shanghai |
| SoC Verification Engineer | India, Bangalore |
| Global Construction EHS Engineer | US, Oregon, Hillsboro |
| Ocotillo Failure Analysis Technician – TEM Prep | US, Arizona, Phoenix |
| Operations Research Engineer | US, Arizona, Phoenix |
| Product Development QRE | Malaysia, Penang |
| Senior Photonic-Integrated-Circuit Integration Engineer | US, California, Santa Clara |
| Module Development Engineer - CMP | US, Oregon, Hillsboro |
| EMIB-T Substrate Yield Lead | US, Arizona, Phoenix |
| Module Development Engineer - RF Test | US, Arizona, Phoenix |
| Partner Marketing Strategist - AI ISV | 2 Locations |
| OTF Failure Analysis Technician - Night Shift | US, Arizona, Phoenix |
| PDK Engineer | India, Bangalore |
| PDK Engineer | India, Bangalore |
| Module Equipment Technician | US, Arizona, Phoenix |
| Module Equipment Technician | US, Arizona, Phoenix |
| Silicon Photonics Component Design Engineer | US, New Mexico, Albuquerque |
| CPU Physical Design Engineer | India, Bangalore |
| CPU Floorplan Lead | India, Bangalore |
| Facilities Site Manager | US, Arizona, Phoenix |
| Thin Films Module Development Engineer | US, Oregon, Hillsboro |
| Module Engineer | US, Arizona, Phoenix |
| Process Integration and Yield Engineer | US, Arizona, Phoenix |
| Construction Contracts Manager | US, Ohio, New Albany |
| Facilities Life Safety Systems (LSS) Engineer | US, Arizona, Phoenix |
| Operations Research Engineer | 3 Locations |
| Back-End TD Reliability Lab Manager | US, Arizona, Phoenix |
| PERC Rule Deck Development Engineer | India, Bangalore |
| EDA Tools Software Engineer | US, Oregon, Hillsboro |
| Facilities Mechanical Engineer | Malaysia, Penang |
| Calibration Lab Engineer | Vietnam, Ho_Chi_Minh_City |
| Transistor Reliability and Quality Engineer | US, Oregon, Hillsboro |
| Facilities Mechanical Engineer | Malaysia, Penang |
| Software Development Engineer - Intel Contract Employee | 3 Locations |
| Intel Foundry Strategic Marketing | 3 Locations |
| Lead Humanoid Robotics System Architect | 4 Locations |
| CPU Circuit Design Engineer | US, Texas, Austin |
| DFT Design Engineer | India, Bangalore |
| Principal Engineer, AI Applied Research | US, Oregon, Hillsboro |
| Design Automation Engineer - Neuromorphic Computing | 5 Locations |
| Product Development/DFX Lead - Neuromorphic Computing | 5 Locations |
| LVS Runset Development Engineer | India, Bangalore |
| Facilities Instrumentation and Controls Engineer | Malaysia, Penang |
| Wireless Connectivity System and Architecture Engineer | 2 Locations |
| Software Engineering - Intern, Graduate | 5 Locations |
| Software Engineering - Intern, Bachelor’s | 5 Locations |
| Silicon Hardware Engineering - Intern, Graduate | 5 Locations |
| Silicon Hardware Engineering - Intern, Bachelor’s | 5 Locations |
| Platform Hardware and Systems Engineering - Intern, Graduate | 5 Locations |
| Platform Hardware and Systems Engineering - Intern, Bachelor’s | 5 Locations |
| Facilities Services - Intern, Bachelor’s | 4 Locations |
| Manufacturing and Process Development - Intern, Graduate | 3 Locations |
| Manufacturing and Process Development - Intern, Bachelor’s | 3 Locations |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro |
| Tool Install Equipment Technicians (contract) | US, Oregon, Hillsboro |
| WPM-NM Die Pick Module Equipment Contract Technician | US, New Mexico, Albuquerque |
| Tool Equipment Install Engineer (Contract) | US, Oregon, Hillsboro |
| Die Prep Module Engineer (Contract Role) | Malaysia, Kulim |
| Sales and Marketing Rotation Program - College Graduate | 5 Locations |
| Sales and Marketing Rotation Program (Technical) - College Graduate | 5 Locations |
| Sales and Marketing - Intern, Graduate | 4 Locations |
| Sales and Marketing - Intern, Bachelor’s | 4 Locations |
| Technical Sales - Intern, Graduate | 4 Locations |
| Technical Sales - Intern, Bachelor’s | 4 Locations |
| Lead Cloud Software Development Engineer with uArch Expertise- Temporary Position | Mexico, Guadalajara |
| Neuromorphic Front-End Silicon Lead | 5 Locations |
| Tool Equipment Install Engineer (Contract) | US, Arizona, Phoenix |
| Tool Equipment Install Engineer (Contract) | US, Arizona, Phoenix |
| Physical AI Solutions Architect | 4 Locations |
| CAD/EDA Tools Automation Engineer | US, Oregon, Hillsboro |
| Principal Engineer- CPU Circuit Design | India, Bangalore |
| Software Enabling and Optimization Engineer | South Korea, Seoul |
| Intern System Software Development Engineer | Malaysia, Kulim |
| Intel NPU Internship | Ireland, Leixlip |
| Module Engineer (Contract) | Malaysia, Penang |
| Senior Reliability PDK and TFM engineer | 4 Locations |
| AutoTEM technician | US, Oregon, Hillsboro |
| Semiconductor Research Integration Engineer | US, Oregon, Hillsboro |
| Silicon SoC Architect | 6 Locations |
| Manufacturing Operator (Contract) | Malaysia, Kulim |
| Module Equipment Technician (Contract) | Malaysia, Kulim |
| Quality and Reliability Engineer | Malaysia, Penang |
| CPU power Architect | Israel, Haifa |
| Substrate Supplier Enablement Engineer | US, Arizona, Phoenix |
| Quality and Reliability Engineer | Malaysia, Penang |
| Facilities Mechanical Engineer | Malaysia, Kulim |
| Module Engineering PhD Intern | US, Oregon, Hillsboro |
| Module Engineering PhD Intern - Wet Etch | US, Oregon, Hillsboro |
| New Mexico Site Automation Integrator | US, New Mexico, Albuquerque |
| Accountant | Malaysia, Penang |
| Module Equipment Technician (Contract) | Malaysia, Kulim |
| Software Development Engineer | 4 Locations |
| Design Verification Engineer | US, California, Santa Clara |
| ADCE Packaging Design Architect | 9 Locations |
| Module Engineer | US, Arizona, Phoenix |
| Semiconductor Packaging Integration Research Manager | 2 Locations |
| Module Engineering PhD Intern New 2027 | US, Oregon, Hillsboro |
| System Technology Research Engineer - (PhD Intern) | 3 Locations |
| Software QA Engineer | US, California, Santa Clara |
| Yield Development Engineer | Malaysia, Penang |
| Facilities Engineering Intern | Vietnam, Ho_Chi_Minh_City |
| Occupational Health Nurse | Taiwan, Taipei |
| Product Manager – AI Software and Solution | 5 Locations |
| Senior Design Verification Engineer - Neuromorphic Computing | 5 Locations |
| Foundry Advanced Packaging Customer Engineer | 5 Locations |
| Manufacturing Operator (Nhân viên vận hành máy) | Vietnam, Ho_Chi_Minh_City |
| Foundry Program Manager, Service Operations and Program Management | 2 Locations |
| Analog Circuit Design Engineer | India, Bangalore |
| Software Application Development Engineer | 2 Locations |
| GPU Design Verification Engineer | India, Bangalore |
| Operations Research, Engineering Analytics Graduate Intern | US, Arizona, Phoenix |
| Senior Analog Design Engineer | US, California, Santa Clara |
| Senior Analog Design Engineer | US, California, Santa Clara |
| TFSM IR EHS Environmental Engineer | Ireland, Leixlip |
| Memory Layout Manager | India, Bangalore |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro |
| Senior CPU Logic Design Engineer | Israel, Haifa |
| Software Enabling and Optimization Engineer | Poland, Gdansk |
| Silicon Photonics Test Engineer | US, California, Santa Clara |
| Hardware Engineer | US, California, Santa Clara |
| AI Performance Library Architect | 2 Locations |
| CPU Pre-Silicon Verification Lead | India, Bangalore |
| Senior Facilities Mechanical Engineer | US, Arizona, Phoenix |
| Platform Hardware Design Engineer | US, Oregon, Hillsboro |
| Senior SiPh Product Development Engineer | 3 Locations |
| Module Equipment Technician (Kỹ Thuật Viên Bảo trì Sửa chữa) | Vietnam, Ho_Chi_Minh_City |
| Manufacturing Quality and Reliability Engineer | Malaysia, Penang |
| Module Development Engineer | US, Oregon, Hillsboro |
| Module Engineer Internship | Ireland, Leixlip |
| Accountant | India, Bangalore |
| Module Engineer | Malaysia, Penang |
| Low Yield Analysis Engineer on Shift | US, Oregon, Hillsboro |
| Physical AI Industry Solutions Manager | 8 Locations |
| Install Qualification Operations Specialist (Contract) | US, Oregon, Hillsboro |
| Install Qualification Operations Specialist (Contract) | US, Oregon, Hillsboro |
| SoC Design Verification Engineer | India, Bangalore |
| AI Platform and Agentic Engineer | India, Bangalore |
| Malaysia Communications Manager | Malaysia, Penang |
| Staff SOC DFT Engineer | Malaysia, Penang |
| Software Enabling and Optimization Engineer | India, Bangalore |
| Module Development Engineering Manager | US, Oregon, Hillsboro |
| Tool Install Equipment Technician (contract) | US, Oregon, Hillsboro |
| CPU–SoC Mask Layout Designer (Diploma Level Contract role) - Silicon Engineering Group (SiG) | 2 Locations |
| E-core CPU Physical Design Engineer | Malaysia, Penang |
| TEG Equipment Engineer (Contract) | Malaysia, Kulim |
| Construction Project Manager | 2 Locations |
| Construction and Tool Install Project Manager (Contract) | Malaysia, Kulim |
| Senior Core Design Verification Engineer | Malaysia, Penang |
| Senior Core Design Verification Engineer | Malaysia, Penang |
| Senior Director, Construction and Facilities Supply Chain (CFSC) | US, Oregon, Hillsboro |
| Intel Foundry Advanced Device Development Engineering Manager | 4 Locations |
| Advanced Packaging Substrate Supplier Enablement Lead | US, Arizona, Phoenix |
| Supply Chain Engineer | US, Oregon, Hillsboro |
| Quantum Qubit Design Engineer | 8 Locations |
| Quality and Reliability Engineer (Advance Packaging & Assembly) | Malaysia, Penang |
| Advance Packaging Material Supply Chain Engineer | 2 Locations |
| Physical Design for PPA Optimization Engineer | Israel, Haifa |
| Director, Process Engineer – Dry Etch | 2 Locations |
| Qubit Control Physical Design Engineer | US, Oregon, Hillsboro |
| Quantum Packaging Signal/Power Integrity (SI/PI) Engineer | US, Oregon, Hillsboro |
| Quantum IC Package Substrate Design Engineer | US, Oregon, Hillsboro |
| Quantum Packaging Thermal Architect | US, Oregon, Hillsboro |
| Quantum Interposer Design Engineer | US, Oregon, Hillsboro |
| Install Qualification Operations Specialist (contract) | US, Oregon, Hillsboro |
| Install Qualification Operations Sr Specialist (Contract) | US, Oregon, Hillsboro |
| Accounting Technical Specialist | Malaysia, Penang |
| Finance Intern | Malaysia, Penang |
| Assembly Handling Systems Development Engineer | Malaysia, Kulim |
| Senior Network Operations Engineer | 2 Locations |
| Ocotillo Failure Analysis Engineer – TEM/Probing Engineer | US, Arizona, Phoenix |
| Intel Mask Operations Module Development Engineer | US, Oregon, Hillsboro |
| Ocotillo Technology Fabrication Yield Integration Technician | US, Arizona, Phoenix |
| Systems and Solutions Engineer | 2 Locations |
| Intel Foundry LTD Product Yield Engineer | 2 Locations |
| Finance Intern | Malaysia, Kulim |
| Systems and Solutions Engineer | India, Bangalore |
| Senior Advanced Packaging Defect Inspection Engineer | US, Oregon, Hillsboro |
| Defect Metrology Tool Install Engineer | US, Oregon, Hillsboro |
| Lithography Tool Install Engineer | US, Oregon, Hillsboro |
| System Software Engineering - PhD Intern | US, Oregon, Hillsboro |
| Director of Global Customer Planning and Operations | 3 Locations |
| Radio Frequency Test Process Engineer | US, Arizona, Phoenix |
| Advanced Packaging Module Development Engineer | US, Oregon, Hillsboro |
| Software Solutions PhD Intern New 2027 | US, Oregon, Hillsboro |
| Graduate Talent (ISCP SoC Front End Team) | Malaysia, Penang |
| Graduate Talent (ISCP SoC Front End Team) | Malaysia, Penang |
| Practical Engineering Student - Kiryat Gat | Israel, Kiryat-Gat |
| Install Qualification Operations Specialist (contract) | US, Oregon, Hillsboro |
| • AI/ML CAD Engineer, RTL & Design Verification | 2 Locations |
| AI GPU Cache Designer | 4 Locations |
| Triton Compiler Engineer | Canada, Toronto |
| Director of Supply Planning - Assembly, Test, and Materials | Malaysia, Kulim |
| GPU Logic Design Engineer | 2 Locations |
| GPU Design Verification Engineer | 2 Locations |
| Senior ASIC DFT Engineer | Israel, Haifa |
| Analog Circuit Design Engineer | India, Bangalore |
| Emulation Engineer | Virtual India |
| Intel Foundry Advanced Device Development Engineer | Taiwan, Taipei |
| Intel Foundry Advanced Device Development Engineer | Taiwan, Taipei |
| OEM Partner GTM Enabling | Taiwan, Taipei |
| Tool Install Structural Engineer | US, Oregon, Hillsboro |
| Printed Circuit Boards (PCB) Supply Chain Engineer | 2 Locations |
| Manufacturing Systems Software Development Engineer | 2 Locations |
| FFEO FORGE Technical Leads Exhaust Engineer | US, Oregon, Hillsboro |
| Yield Development Engineer | US, Oregon, Hillsboro |
| Intel Foundry Advanced Device Development Engineer | US, Oregon, Hillsboro |
| Intel Foundry Process Development Engineer - Lithography | US, Oregon, Hillsboro |
| Mid-level Physical Design Engineer CPU | US, Oregon, Hillsboro |
| Packaging Module Development Engineer | US, Oregon, Hillsboro |
| Research Scientist Intern - Graphics, ML | Virtual US |
| Sr AI Runtime Architect - Neuromorphic Computing | 2 Locations |
| Executive Admin | US, California, Santa Clara |
| Tool Equipment Install Engineer (Contract) | US, Arizona, Phoenix |
| Ocotillo Technology Fabrication Defect Metrology Layer Owner | US, Arizona, Phoenix |
| AMHS Equipment Engineer | US, Oregon, Hillsboro |
| Thermal Analysis Engineer | US, Arizona, Phoenix |
| Construction Tool Install Engineer (Contract) | US, Oregon, Hillsboro |
| Tool Install & Qualification Project Manager | US, Oregon, Hillsboro |
| Lab Engineering Power Technician | 2 Locations |
| Cloud Software Development Engineer | India, Bangalore |
| AI Software Development Engineer | India, Bangalore |
| Cloud Software Development Engineer | India, Bangalore |
| Software Engineer – Datacenter | US, California, Santa Clara |
| Manufacturing Equipment Technician (MTE) - Back End Nights Shift - Shift 6 | US, Arizona, Phoenix |
| EHS Engineer | US, Arizona, Phoenix |
| New Mexico WPM Manufacturing Technician Internship | US, New Mexico, Albuquerque |
| Senior Photonics Design Engineer | US, California, Santa Clara |
| Graphics Hardware Validation Undergraduate Engineering Intern | Canada, Toronto |
| Software Engineering - PhD Intern | US, Oregon, Hillsboro |
| Ocotillo Technology Fabrication Yield Defect Metrology Shift Group Leader | US, Arizona, Phoenix |
| Senior CPU Silicon Analysis Engineer | US, Oregon, Hillsboro |
| Senior CPU Architecture and Benchmarking Engineer | US, Oregon, Hillsboro |
| LTD Product Development Engineer | US, Oregon, Hillsboro |
| EDA Tools Hardware Engineer | 4 Locations |
| Yield Development Engineer | US, Arizona, Phoenix |
| Yield Development Engineer | US, Arizona, Phoenix |
| Manufacturing Equipment Engineering Manager (Assembly) | Malaysia, Penang |
| Memory Electrical Validation Engineer | India, Bangalore |
| Package Design Electrical Engineer | 2 Locations |
| Senior Hardware Design Engineer | Israel, Petah-Tikva |
| Senior Signal Integrity Engineer (Hands-on) | Israel, Petah-Tikva |
| Supply Chain Technical Analyst | Malaysia, Penang |
| Process Integration Development Engineer | US, Oregon, Hillsboro |
| Module Engineer On-Shift (MEOS) – Night Shift (6) | US, Arizona, Phoenix |
| Module Engineer On-Shift (MEOS) – Night Shift (4) | US, Arizona, Phoenix |
| Module Engineer On-Shift (MEOS) – Day Shift (5) | US, Arizona, Phoenix |
| AI Solution Architect Graduate Intern | US, California, Santa Clara |
| AI Solution Architect - Graduate Intern | US, California, Santa Clara |
| Staff EMIB-T Substrate Yield Engineer | 3 Locations |
| Formal Verification Engineer | 3 Locations |
| Cloud Software Development Engineer | US, Oregon, Hillsboro |
| Advanced Packaging Materials Sr. Commodity Manager | 2 Locations |
| Logistics Operations Manager (Transportation) (Contract) | Malaysia, Penang |
| Supplier Management: Substrate Tier 2/3 | Japan, Tokyo |
| Silicon Packaging Design Engineer | India, Bangalore |
| Packaging Module Development Engineer | Malaysia, Kulim |
| (Epi) - Module Development Engineer - (PhD Intern) | US, Oregon, Hillsboro |
| Senior Static Timing Analysis (STA) Engineer | 2 Locations |
| Sr Staff Substrate Yield Lead | US, Arizona, Phoenix |
| Memory Circuit Design Engineer | US, Texas, Austin |
| Analytical Chemistry Lab Technician | US, Arizona, Phoenix |
| Product Failure Analysis Engineer - SCAN Design for Test | US, Oregon, Hillsboro |
| Module Engineer On-Shift (MEOS) – Day Shift (7) | US, Arizona, Phoenix |
| Graduate Talent (E-core CPU Physical Design) | Malaysia, Penang |
| E-Core CPU Design Automation Engineer | Malaysia, Penang |
| Packaging Module Development Engineer | Malaysia, Kulim |
| E-Core CPU Design Automation Engineer | Malaysia, Penang |
| Graduate Talent (Software Application Development Engineer) | 2 Locations |
| Graduate Talent (Software Application Development Engineer) | Malaysia, Penang |
| Construction Project Design Manager (Contract) | Malaysia, Kulim |
| E-Core (Atom) CPU Layout Design Engineer | 2 Locations |
| E-Core (Atom) CPU Layout Design Engineer | 2 Locations |
| Module Engineering - PhD Intern | US, Oregon, Hillsboro |
| GPU Software Performance Intern | Poland, Gdansk |
| Intern C++ Developer - Graphics Compute Driver (AI, HPC) | Poland, Gdansk |
| Defect Characterization Low Yield Analysis Engineer | US, Arizona, Phoenix |
| Data Science and Analytics - PhD Intern | US, Oregon, Hillsboro |
| Intel Foundry Principal Engineer Overlay Development Engineer - Lithography | US, Oregon, Hillsboro |
| Packaging Process Development Engineer | US, Arizona, Phoenix |
| Ocotillo Technology Fabrication Senior Lithography Reticle Engineer | US, Arizona, Phoenix |
| Senior AI Systems and Solutions Architect – Agentic AI and CPU Host | 4 Locations |
| Senior Ethernet Product Manager | 3 Locations |
| Software Development Engineer | 2 Locations |
| Collection Project Management Analyst | 2 Locations |
| Ecosystem Technical Enabling Engineer(SH/BJ) | 2 Locations |
| Ecosystem Technical Enabling Engineer(SZ/SH) | 2 Locations |
| Operations Research Engineer Intern | 2 Locations |
| CPU Physical Design Engineer | US, Texas, Austin |
| Firmware and Development Tools Intern | 2 Locations |
| AI Software Engineering - Workloads Validation Intern | Poland, Gdansk |
| Compiler Engineer | Poland, Gdansk |
| Senior Compiler Engineer | Poland, Gdansk |
| AI Frameworks Intern | Poland, Gdansk |
| GPU Software Development Engineer | India, Bangalore |
| Microarchitecture and Design Engineer - AI SoC | India, Bangalore |
| Pre-Silicon SoC Validation - Technical Lead | India, Bangalore |
| AI Frameworks Engineer - Intern | Poland, Gdansk |
| Construction Project Manager | 3 Locations |
| Compiler Engineering Intern | PRC, Shanghai |
| Sr Deep Learning Verification Engineer | Ireland, Leixlip |
| Module Development Defect Metrology Engineer | US, Oregon, Hillsboro |
| Sr. EDA Tools Engineer - PERC ESD | 4 Locations |
| GPU Software Engineer | US, California, Folsom |
| Sales Account Manager | US, California, Santa Clara |
| Software Research Engineering - (PhD Intern) | US, Oregon, Hillsboro |
| GPU Engineering Manager | 2 Locations |
| Module Engineering PhD Intern 2027 | US, Oregon, Hillsboro |
| Advanced Packaging TD Plating Module Engineer | US, Oregon, Hillsboro |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| 3DIC Platform Wet and Plating Development Manager | US, Oregon, Hillsboro |
| CPU Physical Design Engineer | US, Texas, Austin |
| Process Integration and Yield Technician | US, Arizona, Phoenix |
| Staff EMIB-T Substrate Yield Engineer | 2 Locations |
| Senior CPU Circuit Design Engineer | Malaysia, Penang |
| Senior CPU Circuit Design Engineer | Malaysia, Penang |
| Senior EDA Tools Hardware Engineer | 4 Locations |
| E-core CPU Physical Design Engineer | Malaysia, Penang |
| E-core CPU Physical Design Engineer | Malaysia, Penang |
| E-core CPU Physical Design Engineer | Malaysia, Penang |
| E-core CPU Physical Design Engineer | Malaysia, Penang |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang |
| E-core Senior CPU Physical Design Engineer | Malaysia, Penang |
| AI GPU Arch Perf Optimization Intern | 2 Locations |
| Supplier Management: Substrate | 2 Locations |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| Intel Foundry Module Development Engineer | US, Oregon, Hillsboro |
| CPU Clock Design Engineer | 3 Locations |
| Quality And Reliability Engineer | US, Arizona, Phoenix |
| HPC System Architecture | 2 Locations |
| Intel Foundry Strategic Marketing | 3 Locations |
| Sales Application Engineer - Data Center | 2 Locations |
| WPM-NM Singulation Module Equipment Contract Technician | US, New Mexico, Albuquerque |
| Triton Compiler Engineering Manager | Canada, Toronto |
| AI-Driven Physical Design Engineering (PhD Intern) | 5 Locations |
| Pre-Silicon Verification Engineer | 6 Locations |
| GPU AI Solution Architect | 2 Locations |
| Senior ASIC Verification Engineer | Israel, Haifa |
| Security Hardware Integration Engineer | 2 Locations |
| SoC Design Verification Engineer | India, Bangalore |
| SoC Design Verification Engineer | India, Bangalore |
| SoC Design Verification Engineer | India, Bangalore |
| Module Equipment Technician | Malaysia, Penang |
| Undergraduate Intern Technical (OpenVINO, Neural Network Compression Tools) (f/m/d) | Germany, Munich |
| CDAT Manufacture Technician | PRC, Chengdu |
| AI Software Architect | India, Bangalore |
| Device Engineer | Ireland, Leixlip |
| Senior Standard Cell Library Engineer | 2 Locations |
| Module Engineering - PhD Intern (Advanced Wet Etch and Cleans) | US, Oregon, Hillsboro |
| Process Integration and Yield Technician | US, Arizona, Phoenix |
| Process Integration Development Engineer PhD Intern New 2027 | US, Oregon, Hillsboro |
| NPI Engineer | Malaysia, Kulim |
| NPI Engineer | Malaysia, Penang |
| Substrate Capacity Manager | 3 Locations |
| Ethernet System Integration Engineer | US, Oregon, Hillsboro |
| Ethernet System Integration Engineer | US, Oregon, Hillsboro |
| Product Development QRE | Malaysia, Penang |
| Lead Simulation Architect | India, Bangalore |
| Silicon Design - Flows and Methodology Intern | Mexico, Guadalajara |
| Sales Operations Analyst | Malaysia, Penang |
| Sr. Substrates Engineering & Operations Engineer | Virtual South Korea |
| Network Silicon Architect | Ireland, Leixlip |
| Analog Circuit Design Engineering Manager | India, Bangalore |
| Ireland Site Industrial Engineer | Ireland, Leixlip |
| AI Frameworks Engineer | Poland, Gdansk |
| Reliability Lab Shock and Vibration Testing Engineer | US, Arizona, Phoenix |
| GPU Software Engineering Intern | Poland, Gdansk |
| GPU Software Engineering Intern | Poland, Gdansk |
| Hardware Design Engineer (Temporary position) | Mexico, Guadalajara |
| ATD Laser Development Engineer | US, Arizona, Phoenix |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Supply Chain Program Manager (Contract) | 3 Locations |
| Foundry Services Director Segment Marketing | 3 Locations |
| Intel Foundry Senior Customer Quality Engineer | 2 Locations |
| Senior GPU Physical Design Engineer | 3 Locations |
| Module Development Engineer PhD Intern New 2027 | US, Oregon, Hillsboro |
| Sort/Test Quality & Reliability Engineer (QRE) | US, Oregon, Hillsboro |
| Technology Development Foundry Engineering – Staff Engineer | 5 Locations |
| Substrate Capacity Manager | 2 Locations |
| Module Equipment Technician (Contract) | Malaysia, Penang |
| Logistics Operations Manager for Customs compliance operations | Vietnam, Ho_Chi_Minh_City |
| Senior Construction Manager - Site Logistics (Contract Position) | US, New Mexico, Albuquerque |
| Chassis IP Design Engineer | India, Bangalore |
| Chassis IP Senior Design Engineer | India, Bangalore |
| AI Software Solutions Engineer | India, Bangalore |
| GPU Senior Logic Design Engineer | India, Bangalore |
| E-core CPU Clock Design Engineer | Malaysia, Penang |
| IP RTL Senior Design Engineer | India, Bangalore |
| Security Software Development Engineer | Poland, Gdansk |
| Compiler Engineering Intern | Poland, Gdansk |
| MLIR Compiler Engineering Graduate Intern (f/m/d) | Germany, Munich |
| MLIR Compiler Engineering Undergraduate Intern (f/m/d) | Germany, Munich |
| Quantum Computing Measurement Engineer | US, Oregon, Hillsboro |
| Ocotillo Technology Fabrication Vacuum Systems Group (VSG) Experienced Module Engineer | US, Arizona, Phoenix |
| Senior AI Developer Relations Advocate — Rack Scale | 3 Locations |
| Senior AI Developer Relations Advocate - Agentic Applications | 3 Locations |
| AI Developer Relations - Docs and Learning Experience | 3 Locations |
| Module Development Engineer | US, Oregon, Hillsboro |
| Process Integration & Yield Engineering PhD Intern | US, Oregon, Hillsboro |
| Senior SoC Physical Layout & Full-Chip Integration Engineer | 3 Locations |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| AI Software Validation Engineer | Poland, Gdansk |
| Process Integration and Yield Eng PhD Intern, 2027 | US, Oregon, Hillsboro |
| Module Engineer PhD Intern New 2027 | US, Oregon, Hillsboro |
| SoC Functional Validation Engineer – Central Execution Platform Enabling | Malaysia, Penang |
| SoC Functional Validation Engineer – Central Execution Platform Enabling | Malaysia, Penang |
| Test Chip Design Lead | Malaysia, Penang |
| Robotics Solution Manager | 3 Locations |
| CPU Clock Design Lead | India, Bangalore |
| CPU Senior Floor Plan Engineer | India, Bangalore |
| CPU Senior Clock Design Engineer | India, Bangalore |
| CPU Senior Floor Plan Engineer | India, Bangalore |
| Senior CAD Engineer – Physical Design Signoff | India, Bangalore |
| Senior Technical Lead - CPU Physical Design | India, Bangalore |
| Product and Test Development Engineer | Malaysia, Penang |
| Senior CAD Engineer - Floor Plan | India, Bangalore |
| Product and Test Development Engineer | Malaysia, Penang |
| Sr SOC Emulation Validation Engineer | 2 Locations |
| Sr SOC Emulation Validation Engineer | 2 Locations |
| Yield Development Engineer | Malaysia, Penang |
| Senior EDA Design Automation Engineer - Digital Implementation | Malaysia, Penang |
| EDA Design Automation Engineer | Malaysia, Penang |
| Software Enabling and Optimization Engineer | 3 Locations |
| AI Frameworks Engineer | Poland, Gdansk |
| Semiconductor Device Modeling Engineer | 4 Locations |
| Compiler Engineering Intern | Canada, Toronto |
| AI GPU Power Delivery Pathfinding Researcher | US, Oregon, Hillsboro |
| Construction Tool Install Technician/Too Owner (Thin Films/TF Dielectrics) | US, Arizona, Phoenix |
| Foundry Device Engineer | 3 Locations |
| Module Engineering PhD Intern New 2027 | US, Oregon, Hillsboro |
| Business Development Lead, Neuromorphic Computing | 5 Locations |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Module Engineer On Shift (MEOS) | US, Arizona, Phoenix |
| Principal Technical Program Manager - DTCO & Design Technology Integration | 3 Locations |
| Staff EMIB-T Substrate Yield Engineer | 2 Locations |
| E-core CPU Full Chip Physical Design Engineer | Malaysia, Penang |
| E-core CPU Power Delivery Engineer | Malaysia, Penang |
| Software Engineering Intern | PRC, Shanghai |
| LLM & Agentic AI Performance Engineer | India, Bangalore |
| Staff Logic Design Engineer | Malaysia, Penang |
| AI Application Development Intern | PRC, Shanghai |
| Senior SOC Design Engineer | Malaysia, Penang |
| Foundry New Deal Ops Integration Lead (Backend Logistics) | Malaysia, Penang |
| Testchip Analog Product Development Engineer- HVM position | Malaysia, Penang |
| Manufacturing Equipment Technician (MTE) - Days Backend Shift - Shift 7 | US, Arizona, Phoenix |
| Process Integ and Yield Eng PhD Intern Grade 029 new 2027 | US, Oregon, Hillsboro |
| Circuit Design Engineer | US, California, Folsom |
| Ocotillo Technology Fabrication Defect Metrology Equipment Engineer | US, Arizona, Phoenix |
| System Software Development Engineer | 2 Locations |
| GPU Design Verification Engineer | 3 Locations |
| GPU Design Verification Engineer | 3 Locations |
| Facilities Mechanical Technician | US, Arizona, Phoenix |
| Senior Capacity and Strategic Planning Engineer | US, Arizona, Phoenix |
| Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans | US, Oregon, Hillsboro |
| GPU Validation Engineer | 5 Locations |
| Cloud Software Development Engineer with uArch Expertise- Temporary position | Mexico, Guadalajara |
| Senior AI Software Development Engineer | 3 Locations |
| Ecosystem Technical Enabling Engineer | Taiwan, Taipei |
| Mfg Systems Software Development Engineer | Malaysia, Kulim |
| Lab Engineer | India, Bangalore |
| Accountant (Statutory compliance) | Malaysia, Penang |
| Manufacturing Technician Internship | Ireland, Leixlip |
| Senior Platform Hardware Design Engineer | India, Bangalore |
| Platform Hardware design Engineer | India, Bangalore |
| Finance Construction Settlement and Supply Chain Analyst - Americas | US, Arizona, Phoenix |
| Development Tools Software Engineer Intern (m/f/d) | Germany, Munich |
| AI Model Optimization Engineer | Malaysia, Penang |
| GPU Micro-architect | US, California, Folsom |
| Module Engineering - PhD Intern (Wet Etch) | US, Oregon, Hillsboro |
| Materials Program Manager (Contract) | 3 Locations |
| Construction Tool Install Technician (Contract) | US, Arizona, Phoenix |
| Facilities Water/Waste Treatment Technician | US, Arizona, Phoenix |
| CAD/EDA Tools Automation Engineer | US, Oregon, Hillsboro |
| Facilities Technician Intern | US, New Mexico, Albuquerque |
| GPU Software Engineer | US, California, Folsom |
| Process Integ and Yield Eng PhD Intern Grade 029 | US, Oregon, Hillsboro |
| Facilities Power Distribution Electrical Engineer | US, Arizona, Phoenix |
| CAD/EDA Tools Software Engineer | US, Oregon, Hillsboro |
| Module Equipment Technician (Preventive Maintenance, Contract) | Malaysia, Penang |
| Senior NPI Engineer | 2 Locations |
| Lab Operations Manager | Canada, Toronto |
| Platform Hardware Design Engineer | PRC, Shanghai |
| Manufacturing Equipment Technician (MTE) - Day Shift - Shift 5 | US, Arizona, Phoenix |
| Payroll Specialist (Contract) | Malaysia, Penang |
| Memory Circuit Design Engineer | US, Texas, Austin |
| Software Enabling and Optimization Engineer | South Korea, Seoul |
| AI Software Engineer Intern | PRC, Shanghai |
| Payroll Specialist (Contract) | Malaysia, Penang |
| Logic Design Engineer | Malaysia, Penang |
| Staff Logic Design Engineer | Malaysia, Penang |
| Packaging Module Equipment Development Engineer | US, Arizona, Phoenix |
| DFT Design Engineering Intern | Malaysia, Penang |
| Module Engineering PhD Intern | US, Oregon, Hillsboro |
| AI Software Development Intern | Poland, Gdansk |
| DevOps Software Engineering Intern | Poland, Gdansk |
| Middleware Software Engineering Intern | Poland, Gdansk |
| Process Integration Development Engineer | US, Oregon, Hillsboro |
| Tool Install Project Manager | US, New Mexico, Albuquerque |
| Thin Films Module Engineering - PhD Intern | US, Oregon, Hillsboro |
| Engineering Director, Automated Material Handling Systems | US, Arizona, Phoenix |
| TCM Bulk Chemical Technician | US, Arizona, Phoenix |
| CMP Commodity Manager | 2 Locations |
| Design Verification Graduate Intern 2027 | 2 Locations |
| Ocotillo Technology Fabrication Defect Metrology Technician | US, Arizona, Phoenix |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, Oregon, Hillsboro |
| AI Data Science / Software Engineering PhD Intern New 2027 | US, California, Santa Clara |
| Intel Foundry Module Development Engineer - CMP | US, Oregon, Hillsboro |
| Power Delivery Design Engineer | Canada, Toronto |
| Substrate Supply Commodity Manager | 5 Locations |
| Source To Pay Solutions - Senior Lead | India, Bangalore |
| Senior Compiler Engineer | PRC, Shanghai |
| Senior Compiler Performance Engineer | PRC, Shanghai |
| Compiler Performance Engineer | PRC, Shanghai |
| Compiler Engineer | PRC, Shanghai |
| Senior Demand Planner | 4 Locations |
| Sales Operations and Revenue Analyst | 4 Locations |
| Senior Substrate Engineer | 2 Locations |
| Quality and Reliability System Engineer (Contract) | 2 Locations |
| Senior Process Integration Engineer | 2 Locations |
| Remote Operations Center Manufacturing Technician (Contract) | Malaysia, Penang |
| Board Level Power Delivery Design Engineer | India, Bangalore |
| CPU Senior Timing Engineer | India, Bangalore |
| CPU Power Delivery Engineer | India, Bangalore |
| Diagnostics Firmware Engineer | India, Bangalore |
| GPU IP Integration Model Build Engineer | India, Bangalore |
| GPU IP Lead Emulation Model Build Engineer | India, Bangalore |
| Media AI Software Intern | Poland, Gdansk |
| Testchip Product Development Engineer | Malaysia, Penang |
| System Software Engineering Intern | Poland, Gdansk |
| Photonic System Design Engineer | US, California, Santa Clara |
| Technical Manager- Virtual Platform Team | US, California, Santa Clara |
| Microarchitecture and Design Engineer - AI SoC | 2 Locations |
| Intern Software QA Test Engineer | Poland, Gdansk |
| BIOS Firmware Development Engineer | India, Bangalore |
| Tool Install Manager | US, New Mexico, Albuquerque |
| Sr. Analyst - Long Range Capacity Planning | 4 Locations |
| Government Affairs Program Specialist | Virtual Malaysia |
| System Software Validation Engineer - Edge, Physical AI, and Robotics | US, Arizona, Phoenix |
| Senior Lithography and Photomask Process Engineer | Ireland, Leixlip |
| Silicon Photonics Quality & Reliability Engineer | US, New Mexico, Albuquerque |
| GPU Software Development Engineer | India, Bangalore |
| Platform Integration Engineer | US, California, Santa Clara |
| Foundry Operations Oversight Manufacturing Technician | US, Arizona, Phoenix |
| GPU Software Development Engineer | US, California, Folsom |
| Industrial Engineer - Foundry Strategic Capacity | 3 Locations |
| APTM Yield Analysis/Device Engineer | US, New Mexico, Albuquerque |
| Module Engineering - Day Shift 5 or 7 | US, Arizona, Phoenix |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Information Security Engineer Undergraduate Intern | US, California, Folsom |
| Module Development Engineer - LTD Dry Etch | US, Oregon, Hillsboro |
| Senior AI Systems Architect/Researcher | 3 Locations |
| Senior Strategic IT Portfolio Manager | 3 Locations |
| GPU Software Development Engineer | 2 Locations |
| Defect Review Technician (Contract) | Malaysia, Penang |
| E-core CPU Layout Design Engineer | 2 Locations |
| CPU Physical Design Engineer | India, Bangalore |
| Senior Account Sales Manager | Japan, Tokyo |
| CPU Performance Architect | India, Bangalore |
| GPU Logic Design Engineer | India, Bangalore |
| Signal Integrity Engineer | India, Bangalore |
| Platform Hardware Design Engineer | Malaysia, Penang |
| EDA Tools Hardware Engineer | India, Bangalore |
| Director, Business HR – APJ | 2 Locations |
| GPU Logic Design Engineer | India, Bangalore |
| Mechanical Engineer | Malaysia, Penang |
| SOC Design Engineer – RTL/Logic | India, Bangalore |
| DevOps Engineering Intern | Poland, Gdansk |
| Software Development Intern (m/f/d) | Germany, Munich |
| Solution Engineer — Agentic Platform | Saudi Arabia, Riyadh |
| Manufacturing Operations Manager Day Shift - Advanced Packaging | US, Arizona, Phoenix |
| Mixed Signal Design Verification Engineer | 2 Locations |
| Enterprise Systems Analyst | 4 Locations |
| SoC Design Verification Engineer | 3 Locations |
| Compiler Engineering Graduate Intern | Canada, Toronto |
| Director, Silicon Photonics - Business Development | 3 Locations |
| SoC Debug Engineer | 5 Locations |
| GPU Design Verification Engineer | US, California, Folsom |
| GPU Design Verification Engineer | US, California, Folsom |
| ORAP Module Equipment Technician, Night Shift | US, Oregon, Hillsboro |
| Design Verification Engineer | 2 Locations |
| Senior GPU Driver and Graphics Performance Engineer | 3 Locations |
| Construction Project Manager | US, Arizona, Phoenix |
| Executive Administrative Assistant and Office Manager | US, Washington, D.C. |
| Automated Material Handling System (AMHS) Equipment Technician | US, New Mexico, Albuquerque |
| APTD_SWA S5 Manufacturing Technician | US, Arizona, Phoenix |
| Intel Foundry/PCC Semiconductor Manufacturing Student Technician – ICE Program | US, Oregon, Hillsboro |
| Member of Technical Staff - Thin Films Engineer | US, Oregon, Hillsboro |
| Infrastructure Storage Engineer | US, Arizona, Phoenix |
| Module Equipment Technician, Night Shift 6 | US, Oregon, Hillsboro |
| Infrastructure Systems Engineer | US, Arizona, Phoenix |
| Senior CPU RTL Design Engineer | 2 Locations |
| Facilities Engineering Intern (Total Gas Chemical Management) | Malaysia, Penang |
| Mixed Signal IP Verification Engineer | India, Bangalore |
| Analog Circuit Design Engineer | India, Bangalore |
| Silicon Design Verification Engineer | India, Bangalore |
| Verification Engineer – AI SoC Development | Canada, Toronto |
| Manufacturing Operations Manager (Contract) | Malaysia, Kulim |
| Senior Low-Level Software Engineer | India, Bangalore |
| Low-Level Software Engineer | India, Bangalore |
| Sort Interface Pathfinding and Development Engineer | US, Oregon, Hillsboro |
| Facilities Electrical Internship program | Malaysia, Penang |
| GPU Logic Design Engineer | India, Bangalore |
| GPU Design Verification Engineer | India, Bangalore |
| WPM Wafer Sort Module Equipment Technician | Ireland, Leixlip |
| Facilities Services - Intern, Graduate | 4 Locations |
| DevOps Engineering Intern | Poland, Gdansk |
| Payroll Business Analyst - Intel Contract Employee | 2 Locations |
| Technology Executive Communications | 3 Locations |
| Senior Business Strategist | 2 Locations |
| Sr Back-End Facilities Development Engineer | 2 Locations |
| Senior Thin Films Metals Deposition Engineer | US, Oregon, Hillsboro |
| Strategic / Development Industrial Engineer (Senior Individual Contributor) | 3 Locations |
| Intel Foundry Module Development Engineer | US, Oregon, Hillsboro |
| Module Engineering - Day Shift 5 or 7 | US, Arizona, Phoenix |
| TD Memory Quality and Reliability Engineer | 3 Locations |
| Module Development Engineer (Ph.D.) - Intel Foundry | US, Oregon, Hillsboro |
| CBS E2E Finance Architect | 4 Locations |
| CPU Pre-Si Verification Sr Engineer | Mexico, Guadalajara |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Oregon Advanced Packaging Module Engineer - Laser | US, Oregon, Hillsboro |
| AI Hardware Engineering Intern | 2 Locations |
| Senior Director, Corporate Development | US, California, Santa Clara |
| Senior Unreal Engine Developer Technology Engineer | US, California, Folsom |
| Deep Learning Hardware Engineer | 2 Locations |
| Sort and Die Prep Quality and Reliability Engineer | Malaysia, Kulim |
| Silicon Packaging Design Engineer | India, Bangalore |
| Silicon Packaging Design Engineer | India, Bangalore |
| HPC and Financial Workload Optimization Engineer | PRC, Shanghai |
| CPU RTL Design Manager | India, Bangalore |
| AI Software Development Engineer | PRC, Shanghai |
| Module Engineer within Test Engineering Department | Vietnam, Ho_Chi_Minh_City |
| Senior Azure DevOps Engineer | India, Bangalore |
| GPU Architecture and AI Performance Simulation Engineer | India, Bangalore |
| Manufacturing Technician | Vietnam, Ho_Chi_Minh_City |
| AI System Performance Architect | India, Bangalore |
| Facilities Experienced Electrical Engineer - Kiryat Gat | Israel, Kiryat-Gat |
| Power Management Firmware Development Team lead | Israel, Haifa |
| Engineering Student for Intel Kiryat Gat | Israel, Kiryat-Gat |
| NMSi Silicon Photonics Yield Analysis Engineer | US, New Mexico, Albuquerque |
| WPM C4 Quality and Reliability Engineer | US, Oregon, Hillsboro |
| Silicon Design Verification Engineer | India, Bangalore |
| TD Media and Collaterals Development Engineer | US, Arizona, Phoenix |
| Software Application Development Engineer | 3 Locations |
| GPU Validation Engineer | Canada, Toronto |
| Module Engineering - PhD Intern | US, Oregon, Hillsboro |
| Senior Compiler Engineer | Canada, Toronto |
| Compiler Engineer | Canada, Toronto |
| Sales Operations Analyst | 4 Locations |
| Intel Foundry LTD Product Yield Development Engineer | 3 Locations |
| Software Integration Engineer | 2 Locations |
| Gases Technician | US, Arizona, Phoenix |
| Packaging Module Equipment Development Engineer | US, Arizona, Phoenix |
| Senior Infrastructure and DevOps Systems Engineer | 5 Locations |
| Module Equipment Technician | Malaysia, Kulim |
| Data Center Structure Design Engineer | PRC, Shanghai |
| Platform Signal/Power Integrity Engineer Lead | Malaysia, Penang |
| EDA Tools License Management | India, Bangalore |
| Module Engineer for Assembly Department | Vietnam, Ho_Chi_Minh_City |
| Advanced Packaging Development Engineer | US, Arizona, Phoenix |
| Physical Design Automation Engineer | India, Bangalore |
| Defect Review Technician | Malaysia, Penang |
| CPU Validation Engineer | Malaysia, Penang |
| AR Collection Analyst | PRC, Shanghai |
| Robotics and Physical AI Developer Support Engineer | India, Bangalore |
| Analog Design Engineer | India, Bangalore |
| GPU Design Verification Engineer | 2 Locations |
| GPU Design Verification Engineer | 2 Locations |
| AMHS Equipment Technician | US, Oregon, Hillsboro |
| RTL Design Engineer | 3 Locations |
| Senior / Staff Dry Etch Process Development Engineer | US, New Mexico, Albuquerque |
| Oregon Advanced Packaging Module Engineer | US, Oregon, Hillsboro |
| Pre-Si Validation Engineer | Canada, Toronto |
| Ocotillo Technology Fabrication Process Integration and Yield Engineer | US, Arizona, Phoenix |
| GPU & AI Accelerator Hardware Design Undergraduate Intern | Canada, Toronto |
| Quality Manager | US, Arizona, Phoenix |
| AI Software Engineering PhD Intern | 2 Locations |
| Memory Firmware Engineer | 2 Locations |
| GPU Driver and Graphics Performance Engineer | 3 Locations |
| Module Engineering (PhD Intern) | US, Oregon, Hillsboro |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Firewall Network Security Engineer | US, California, Santa Clara |
| Demand Planning Analyst | 4 Locations |
| GPU Design Verification Engineer | US, California, Folsom |
| Process Integration Development Engineer | US, Oregon, Hillsboro |
| Packaging Module Development Engineer | US, Arizona, Phoenix |
| Process Integration Development Engineer - Defect Metrology | US, Oregon, Hillsboro |
| Process Integration Development Engineer - Defect Metrology | US, Oregon, Hillsboro |
| Process Integration Development Engineer - Defect Metrology | US, Oregon, Hillsboro |
| Senior Compiler Engineer - Triton and DSLs | Canada, Toronto |
| Compiler Engineer - Triton and DSLs | Canada, Toronto |
| C4/FBE Metro Module Engineer in WPM Organization | US, New Mexico, Albuquerque |
| AI Software Engineer Intern | 3 Locations |
| E-core CPU Design Manager | Malaysia, Penang |
| Network Systems and Solutions Engineer | 2 Locations |
| AMHS Hardware Engineer | Ireland, Leixlip |
| Security Researcher Technical Lead | Israel, Haifa |
| FPGA Prototyping Engineer | Malaysia, Penang |
| FPGA Prototyping Engineer | Malaysia, Penang |
| Senior PDK Reliability Engineer | 4 Locations |
| Automated Material Handling System (AMHS) Equipment Technician | US, New Mexico, Albuquerque |
| AMHS Module Equipment Technician | Ireland, Leixlip |
| Sort Probe Card Module Engineer | US, New Mexico, Albuquerque |
| Die Sort Module Engineer | US, New Mexico, Albuquerque |
| Process Integration Development Engineer PhD Intern 2027 | US, Oregon, Hillsboro |
| Compiler Engineer for AI DSLs | 4 Locations |
| AI Software Development Engineer - Neuromorphic Computing (m/f/d) (Fixed-Term) | Germany, Munich |
| AI Software Development Engineer - Neuromorphic Computing | US, California, Santa Clara |
| Silicon Photonics TD Process/Product Integration Engineer | US, New Mexico, Albuquerque |
| Facilities Electrical Engineer | US, Oregon, Hillsboro |
| Foundry Construction, Supply Chain and Sourcing Intern – Undergraduate | 5 Locations |
| Customer Product Development Engineer | 2 Locations |
| Foundry Construction, Supply Chain and Sourcing Intern – Graduate | 5 Locations |
| LTD RET Software/Research Engineer | US, Oregon, Hillsboro |
| Design Automation Engineer (TFM/EDA) | 4 Locations |
| Ocotillo Technology Fabrication Yield Analysis Engineer | US, Arizona, Phoenix |
| Design Automation Engineer (TFM/EDA) | 4 Locations |
| EDA Tools Software Engineer | US, Oregon, Hillsboro |
| CPU Power Management and Performance Architect | 2 Locations |
| Central Document Control Manager | US, Oregon, Hillsboro |
| Senior CPU Performance Architect | 5 Locations |
| Senior Out-of-Order CPU Architect | US, Texas, Austin |
| Senior CPU RTL Design Engineer | 2 Locations |
| Senior CPU Front End Methodology Engineer | 3 Locations |
| Senior Middleware Software Development Engineer | 2 Locations |
| Senior Middleware Development Engineer | 2 Locations |
| Database Administrator PL/SQL Developer | 2 Locations |
| SoC Compute/Memory Subsystem Architect | Ireland, Leixlip |
| Senior DFT Logic Design Engineer | 3 Locations |
| Experienced Manufacturing Technician | Ireland, Leixlip |
| Senior Post Silicon CPU Debug Engineer | Israel, Haifa |
| Senior Systems Engineer – Windows Active Directory | 2 Locations |
| Construction Project Engineer (Civil, Structural, Architectural) | US, Arizona, Phoenix |
| Silicon Packaging Design Architect | US, Arizona, Phoenix |
| Senior Wet Etch Manufacturing Development Engineer | 2 Locations |
| Senior Verification Engineer | Ireland, Leixlip |
| Early Careers Manufacturing Technician | Ireland, Leixlip |
| Defect Metrology Engineer | Ireland, Leixlip |
| Yield Product Development Engineer | 2 Locations |
| Senior Software Development Engineer (Contract Position) | US, Arizona, Phoenix |
| Senior Analog and Mixed Signal Design Engineer | 2 Locations |
| Hardware Platform Applications Engineer - Military & Aerospace | 4 Locations |